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A mechanically induced fracturing or delamination on or below the surface of the base material, haloing is usually exhibited by a light area around holes, other machined areas, or both Haloing should not penetrate more than 50 percent of the distance to the nearest conductor and should not reduce electrical spacing below the given requirement 511113 Conductor Pattern Integrity Several methods can be used to determine conductor pattern integrity Comparison equipment, overlays, and AOI machines are routinely used to compare the pattern to the digital image of the pattern The most common conductor pattern inspection tool is the aided human eye using low (<3 ) magnification The loss of adhesion and imperfections that reduce the conductor volume or spacing make up this category of imperfections Voids in conductors and lands can be detrimental to function, depending on the degree of imperfection.

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Microelectro-mechanical Systems (MEMS)

Voids or pinholes reduce the effective conductor width, reduce current-carrying capacity, and can affect other design electrical characteristics, such as inductance and impedance Voids in lands are also detrimental to solderability Pinholes or voids in the conductor or land can undermine the finish coating The presence of conductive elements in areas in which they were not intended can reduce spacing to a point where the insulation between conductors can be jeopardized The degree that these imperfections affect the PCB depends on the intended design of the circuit The imperfections in this group are defined as follows (see Fig 515)..

FIGURE 51.5 Dents, pits, pinholes and voids. (Courtesy of Sandia Laboratories.)

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Photograph of the SniffStick under fabrication 260 Block diagram of the AstroDat data acquisition system 262 Circuit schematic for AstroDat data acquisition system 264 Signals illustrate the AVR processor controlling the MAX186 ADC 265 Signals illustrate the AVR processor controlling the Dallas DS1302 RTC 265 Signals illustrate the AVR processor controlling the Atmel At24C512 EEPROM 266 Sample data plot of a sinewave generated by a function generator and recorded by the AstroDat System The X axis is time in ms and the Y axis is volts 267 Completed AstroDat circuit board inside a plastic enclosure 268 Format for the various tags 269 Flowchat for user interaction using the two keys: Acquire and Menu 271 A security lock on the RS-232 port of the PC 279 A security lock on the PC parallel port with a pass-through port.

Dent This is a smooth depression in the conductive foil that does not significantly decrease foil thickness.

Thermal and mechanical stress on resin-to-glass bond. Volatilized components can also stress this bond.

Cleanliness, moisture resistance, and choice of proper coupling agent for resin adhesion are more important. Copper nodularization and roughness, treatments for improved adhesion, i.e. coupling agents.

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Plastic injection moulding is done in the metal structure which acts as a mould The substrate material used in a LIGA process must necessarily be an electrical conductor or an insulator coated with electrically conductive materials Common materials include austenitic steel, copper plated with gold, titanium or nickel and silicon wafers with a titanium layer The PMMA material has a high X-ray sensitivity, dry and wet etching resistance when unexposed and thermal stability The completed microstructure is one in which all three materials remain adhered, prohibiting the fabrication of some micromachined parts such as free spinning rotors It was found that the use of sacrificial materials would facilitate the fabrication of components that are partially or completely free from the substrate In the sacrificial LIGA (SLIGA) process, polyamide is first deposited on a silicon wafer as a sacrificial layer [9] This allows the separation of the finished mould from the substrate after the electroplating This is achieved by etching away the sacrificial layer LIGA is a very expensive process and requires a special synchrotron radiation facility for deep X-ray lithography In addition, it requires the development of microinjection moulding technology and a facility for mass production purposes However, LIGA offers many advantages such as unlimited aspect ratios, flexible microstructure configurations and geometry, production of metallic microstructures and provision for injection moulding

Brist, Gary, Hall, Stephen, Clauser, Sidney, and Liang,Tao, Non-Classical Conductor Losses Due to Copper Foil Roughness and Treatment, ECWC 10/IPC/APEX Conference, February 2005.

Definition of Epoxy One of the most common versions of epoxy resin for printed circuit applications is manufactured from reacting epichlorohydrin and bisphenol-A. This reaction is shown in Fig. 7.1. The bromination of the bisphenol-A provides flame retardancy to the finished resin system.

Figure 7.2 shows the structure of tetrabromobisphenol-A, Br Br CH3 or TBBPA. Figure 7.3 shows a reaction used to manufacture brominated epoxy resins. Brominated epoxy OH C resins such as this are the most common component HO used to incorporate flame retardancy to the finished CH3 Br Br product, although non-halogen-based flame retardants can also be used, and are discussed in Sec. 7.4.2.3. The FIGURE 7.2 Tetrabromobisphenol-A triangular rings on either end of the difunctional epoxy (TBBPA). are the epoxide functional groups. In subsequent resin polymerization, these groups react and result in the curing of the resin system. The OH groups present on the epoxy molecule also react with the epoxide groups, providing cross-linking among the epoxy molecules (see Fig. 7.4).

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