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280 An 8-bit linear feedback shift register with taps at bit positions 1, 2, 3 and 7 281 Block diagram of the lock and the PC parallel port signal configuration 282 A 1-input AND gate used as a level isolation circuit 283 The effect of driving a 1-input diode AND gate with a logic signal 283 Circuit schematic for the PC parallel-port-based security lock using AT90S2343 284 Data transfer between a Master and a Slave using Strobe and Ack handshake lines 285 Scope trace illustrates the time relationship between the strobe generated by the PC as the Master and the Ack by the AT90S2343 as a slave 286 Scope trace shows 8 bits of data setup by the PC while sending to the processor and returning data generated by the processor.

Brominate epoxy resin O CH2 CH CH2 Br O Br CH3 C CH3 Br O CH2 CHOH CH2 Br Br O Br n CH3 C CH3 Br Br O

The term packaging commonly includes assembly, packaging and testing and is often associated with a high cost and the largest cause of failures The idea is to protect the silicon chip and the wire bonds from environmental effects and at the same time allow the dies to probe the environment Microsystem packaging is generally categorized into three levels: the die level, device level and the system level as shown in Figure 841 Die level packaging involves the assembly and protection of

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Difunctional Epoxies The epoxy resins shown in Figs. 7.1 and 7.3 are difunctional epoxies. The molecular weight of the epoxy can be varied based on the number of repeating groups shown in the center of the molecule. On either end of the molecule, you see the epoxide functional groups. The name difunctional epoxy is derived from the fact that there are two epoxide groups, one on either

end of the molecule. The molecular weight, the curing agents used to react the resin and other factors will affect the finished properties of the resin system, including Tg and Td. The Tg is the temperature at which the resin turns from a rigid or glassy state to a softer, more deformable state. The Tg is important because it affects the thermal and physical properties of the base material and finished circuit board, especially thermal expansion properties. The Td is the decomposition temperature and will influence thermal reliability of the printed circuit.These properties are discussed in more detail in Chaps. 6 and 8, and again in Chap. 10 as they relate to compatibility with lead-free assembly processes. Difunctional epoxies can have a range of Tg s, but are typically below 120 C. These epoxies are sometimes used in relatively unsophisticated products such as simple double-sided printed circuits, but are more commonly blended with other epoxies in higher performance systems.

Tetrafunctional and Multifunctional Epoxies The use of epoxy compounds with more than two epoxide functional groups per molecule results in greater cross-linking when the resin is cured. Among other things, this can result in higher Tg levels. Resin systems with these types of epoxies can exhibit improved thermal and physical properties. However, the curing chemistry will also have an impact on these properties, and often the higher-Tg materials can be harder and more brittle, requiring process adjustments in the printed circuit manufacturing process. Common commercially available laminate materials based on epoxy resin systems can be segmented into a few Tg ranges, 125 to 145 C, 150 to 165 C, and greater than 170 C.There are epoxy systems above190 C, but they are less common.These resin systems are normally blends of difunctional, tetrafunctional, and multifunctional epoxy resins. Figures 7.5 and 7.6 are examples of tetrafunctional and multifunctional epoxies. A cost-performance trade-off exists among the commonly used epoxy resin systems. In general, resin systems offering higher levels of Tg and Td will cost more. In addition, the highTg systems can incur increased circuit manufacturing costs, due primarily to increased multilayer lamination cycle times and decreases in drilling productivity. However, the improvement in performance is often required to meet design and reliability requirements. 11 outlines a procedure for selecting cost-effective materials for various printed circuit designs.

Pit or dish-down This is a depression in the conductive layer that does not penetrate entirely to the base material but does reduce the cross-sectional area of the conductor. These imperfections are almost impossible to detect as they rarely give visual cues to the inspector. Scratch This is a slight surface mark or cut that may or may not go all the way through to the base material. Void or Pinhole This is the absence of conductive material in a localized area going all the way to the base material.

Fig 841: MEMS packaging [6]

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